Ring for use in a semiconductor wafer heat processing apparatus



FIG. 1 a perspective view of a ring for use in a semiconductor wafer heat processing apparatus;

FIG. 2 a top plan view thereof;

FIG. 3 a front elevational view thereof;

FIG. 4 a bottom plan view thereof;

FIG. 5 a right side view thereof;

FIG. 6 a rear elevational view thereof; and,

FIG. 7 a cross-sectional view taken along line VII--VII in FIG. 3. 

I claim the ornamental design for a ring for use in a semiconductor wafer heat processing apparatus, as shown and described. 